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Rogers RT/duroid 5870 DK2.33 Df0.0012 (0.127-1.575mm) Copper Clad Laminate
Brief Introduction
RT/duroid 5870 is a glass microfiber reinforced PTFE composite designed for exacting stripline and microstrip circuit applications. The randomly oriented microfibers result in exceptional dielectric constant uniformity, which is consistent from panel to panel and over a wide frequency range. Its low dissipation factor extends its usefulness to Ku-band and beyond. The material is easily machined and resistant to common PCB processing chemicals.
Technical Features & Benefits
Exceptional dielectric constant uniformity due to randomly oriented glass microfibers.
Stable dielectric constant (Dk) over a wide frequency range and from panel to panel.
Very low dissipation factor, enabling high-frequency performance up to Ku-band and above.
Easy to cut, shear, and machine.
Resistant to solvents and reagents used in standard PCB fabrication.
Compatible with lead-free processing.
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Typical Properties: RT/duroid 5870
| Property |
Direction |
Units |
Condition / Test Method |
RT/duroid 5870 |
| Dielectric Constant, εr Process | Z | – | 10 GHz, IPC-TM-650 2.5.5.5 | 2.33 ± 0.02 |
| Dielectric Constant, εr Design | Z | – | 8 GHz - 40 GHz, Differential Phase Length | 2.33 |
| Dissipation Factor, tan δ | Z | – | 10 GHz, IPC-TM-650 2.5.5.5 | 0.0012 |
| Thermal Coefficient of εr | Z | ppm/°C | -50 - 150°C, IPC-TM-650 2.5.5.5 | -115 |
| Volume Resistivity | Z | Mohm·cm | C96/35/90, ASTM D257 | 2 X 10⁷ |
| Surface Resistivity | Z | Mohm | C/96/35/90, ASTM D257 | 2 X 10⁷ |
| Moisture Absorption | N/A | % | 0.062" (1.6mm) D48/50, ASTM D570 | 0.02 |
| Thermal Conductivity | Z | W/m·K | 80°C, ASTM C518 | 0.22 |
| Coefficient of Thermal Expansion | X | ppm/°C | 0-100°C, IPC-TM-650 2.4.41 | 22 |
| Y | ppm/°C | 0-100°C, IPC-TM-650 2.4.41 | 28 |
| Z | ppm/°C | 0-100°C, IPC-TM-650 2.4.41 | 173 |
| Density | N/A | gm/cm³ | N/A, ASTM D792 | 2.2 |
| Copper Peel Strength | N/A | pli (N/mm) | 1 oz (35mm) EDC foil after solder float, IPC-TM-650 2.4.8 | 27.2 (4.8) |
| Flammability | N/A | UL-94 | N/A | V-0 |
| Lead-Free Process Compatible | N/A | – | N/A | Yes |
Application Areas
RT/duroid 5870 laminates are designed for high-frequency circuit applications, including but not limited to:
Stripline and microstrip circuits.
High-frequency and RF components for communication systems.
Applications requiring stable electrical performance up to Ku-band and beyond.
Available Configurations
Standard Panel Sizes:
18" X 12" (457 X 305mm)
18" X 24" (457 X 610mm)
Additional panel sizes available.
Standard Claddings:
Electrodeposited Copper Foil: ½ oz. (18µm), 1 oz. (35µm).
Rolled Copper Foil: ½ oz. (18µm), 1 oz. (35µm).
Additional claddings (heavy metal, resistive foil, unclad, aluminum, copper, or brass plate) are available upon request.
Standard Thicknesses (Typical):
0.005" (0.127mm) ±0.0005"
0.010" (0.252mm) ±0.0007"
0.020" (0.508mm) ±0.0015"
0.031" (0.787mm) ±0.0020"
0.062" (1.575mm) ±0.0030"
Additional thicknesses available from 0.0035" to 0.375".
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